FDTLM Analysis of Broadband Flip-Chip Interconnections

Flip-chip interconnections between MMIC´s and the motherboard are analyzed rigorously using the frequency-domain TLM (FDTLM) method. It is found that flip-chip packaging shows generally better performance than wire bond transitions and that the reflections from the bump discontinuity depends critically on the bump height and the type of transmission line used. Bump discontinuities between CPW motherboard and CPW chip show better transition performance than bump transitions between mincrostrip lines. For small overlap length between transmission lines the effect on the s-parameters is negligible.