DocumentCode :
2122015
Title :
Graphical methods for robust design of a semiconductor burn-in process
Author :
Rosen, Scott L. ; Geist, Chad A. ; Finke, Daniel A. ; Nanda, Jyotirmaya ; Barton, Russell R.
Author_Institution :
Harold & Inge Marcus Dept. of Ind. & Manuf. Eng., Pennsylvania State Univ., University Park, PA, USA
Volume :
2
fYear :
2001
fDate :
2001
Firstpage :
1231
Abstract :
Discrete-event simulation is a common tool for the analysis of semiconductor manufacturing systems. With the aid of a simulation model, and in conjunction with sensitivity analysis and metamodeling techniques, robust design can be performed to optimize a system. Robust design problems often include integer decision variables. This paper shows a graphical approach to robust design that is effective in the presence of discrete or qualitative variables. The graphical robust design methodology was applied to a backend semiconductor manufacturing process. Changes in specific resource capacities and product mix were examined to determine their effect on the level and variance of cycle time and work in process
Keywords :
design of experiments; discrete event simulation; integrated circuit manufacture; integrated circuit testing; process control; production engineering computing; production testing; semiconductor process modelling; sensitivity analysis; backend semiconductor manufacturing process; cycle time; discrete-event simulation; experimental design; graphical methods; integer decision variables; metamodeling techniques; product mix; robust design; semiconductor burn-in process; sensitivity analysis; simulation model; specific resource capacities; work in process; Analytical models; Assembly; Design methodology; Fabrication; Manufacturing processes; Performance evaluation; Robustness; Semiconductor device manufacture; Semiconductor device packaging; Semiconductor device testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation Conference, 2001. Proceedings of the Winter
Conference_Location :
Arlington, VA
Print_ISBN :
0-7803-7307-3
Type :
conf
DOI :
10.1109/WSC.2001.977439
Filename :
977439
Link To Document :
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