Thermal-electronic devices and thermal-electronic logic circuits (TELC)

The core of this work is to introduce a new electro-thermal device operation principle based on a thermally controlled temperature sensitive component. General conditions for operation and results from practical realization are summarized for this new functional thermal-electronic device (phonsistor) and the CMOS compatible thermal-electronic logic circuit (TELC) formed of phonsistors. Our experimental TELC devices has been realized in lateral form using thin VO2 layers on oxidized silicon substrate and thin platinum layers as metallization and contact electrodes.