The method of measuring the efficiency of heat transfer through thermal interface materials in microelectronics packaging

The miniaturization trend of electronic devices and simultaneous increase of packaging density and clock frequency can generate the large amount of heat that appears during operation of such devices. The thermal interface materials (TIMs) are currently one of the most important materials used in electronic packaging, because their role is to reduce the thermal contact resistance between the heat source (i.e. silicon chip) and heat sink (i.e. substrate or package of integrated circuit). Such materials based on nano- and micro-sized additives can improve the efficiency of heat dissipation. Within the paper the method of measuring of the efficiency of heat transfer through structures with thermal interface materials which was based on measurement of temperature using thermographic IR camera was presented.