DocumentCode
2122396
Title
Study of high power COB LED modules with respect to topology of chips
Author
Vakrilov, Nikolay ; Andonova, Anna ; Kafadarova, Nadejda
Author_Institution
FEET, Technical University of Sofia, Bulgaria
fYear
2015
fDate
6-10 May 2015
Firstpage
108
Lastpage
113
Abstract
The thermal influence of the topology of the COB (Chip-on-Board) LED modules is examined. For this purpose CFD simulations of a powerful COB LED module thermal model are carried out and the thermal distribution at different locations of LED chips is analyzed. Simulation experiments are designed, using the substrates of ceramic materials - Alumina (Typical), Alumina (94 %), Alumina (96 %) and AlN. The thermal efficiency of four different structures of COB LED modules with different modes of operation and environment is examined. The simulation results are verified with thermal measurements.
Keywords
Aluminum nitride; Electronic packaging thermal management; Heating; III-V semiconductor materials; Junctions; Light emitting diodes; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology (ISSE), 2015 38th International Spring Seminar on
Conference_Location
Eger, Hungary
Type
conf
DOI
10.1109/ISSE.2015.7247972
Filename
7247972
Link To Document