Heat treatment of epoxy resin used for BGA chip capillary underfilling from thawing to curing

This paper describes the thermal management of an epoxy resin used for Ball Grid Array type chips capillary underfilling. The setup and validation procedure involving some safe-launch activity part of a New Product Launch is focusing on the heat treatment of glue from technical, quality and productivity standpoint. It describes a self-designed and built preconditioning device as well as all lab measurement and thermal analysis carried out prior to launching a new production line of Continental in the Budapest factory.