DocumentCode
2122688
Title
A comparison of the shear strength of conductive adhesives and soldering alloys
Author
Hirman, Martin ; Steiner, Frantisek
Author_Institution
University of West Bohemia, Faculty of Electrical Engineering, Department of Technologies and Measurement, Pilsen, Czech Republic
fYear
2015
fDate
6-10 May 2015
Firstpage
167
Lastpage
172
Abstract
This paper describes the influence of the cure schedule on the shear strength of the joint glued by EPO-TEK® H20S and 8331S. This work also describes the influence of solder alloy types on the shear strength of the solder joint. Joints were made by soldering and gluing of chip resistors 1206, 0805 and 0603 with different temperature profiles on rigid and flexible substrates. For soldering profiles were calculated heating factors. These profiles have an effect on the mechanical strength of the joint. Samples are measured after curing/soldering process by using shear strength test.
Keywords
Conductive adhesives; Curing; Joints; Metals; Soldering; Substrates; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology (ISSE), 2015 38th International Spring Seminar on
Conference_Location
Eger, Hungary
Type
conf
DOI
10.1109/ISSE.2015.7247983
Filename
7247983
Link To Document