DocumentCode
2122965
Title
Influence of current and combined thermo-current load on microstructure and resistance of solder joints
Author
Cabuk, Pavol ; Durisin, Juraj ; Pietrikova, Alena
Author_Institution
Department of Technologies in Electronics, Faculty of Electrical Engineering and Informatics, Technical University of Košice, Slovak Republic
fYear
2015
fDate
6-10 May 2015
Firstpage
223
Lastpage
225
Abstract
The aim of our work is to evaluate an influence of current and combined thermo-current load on microstructure and electrical resistance of solder joints. The solder joints formed on bare Cu printed circuit board pads were long-term loaded by large current and high temperature. The obtained results clearly show that the both load methods significantly affect microstructure and electrical resistance of the joints. The both loads lead to a formation of extensive voids in the solder joints due to the effect of electromigration thus causing evident increase of their resistance. The resistance increase is more significant for the joints loaded by the combined thermo-current load.
Keywords
Aging; Current density; Electromigration; Joints; Metals; Resistance; Soldering;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology (ISSE), 2015 38th International Spring Seminar on
Conference_Location
Eger, Hungary
Type
conf
DOI
10.1109/ISSE.2015.7247994
Filename
7247994
Link To Document