DocumentCode
2123204
Title
Influence of flux throughout reflow process on FBGA solder balls
Author
Vala, Radek ; Rihak, Pavel ; Szendiuch, Ivan
Author_Institution
Department of Microelectronics, Brno University of Technology, Czech Republic
fYear
2015
fDate
6-10 May 2015
Firstpage
250
Lastpage
254
Abstract
The paper is focused on influence of flux during reflow process. Smaller and lighter FBGA packages caused formation of defects. Analysis of proper soldering process of FBGA components is crucial for correct function of a device. Detection of defects after reflow process is an important part of solder joints reliability. This paper deals with particular parameters which affected yield of FBGA rework process.
Keywords
Electronics packaging; Joints; Lead; Liquids; Reflow soldering;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology (ISSE), 2015 38th International Spring Seminar on
Conference_Location
Eger, Hungary
Type
conf
DOI
10.1109/ISSE.2015.7248000
Filename
7248000
Link To Document