Title :
Influence of flux throughout reflow process on FBGA solder balls
Author :
Vala, Radek ; Rihak, Pavel ; Szendiuch, Ivan
Author_Institution :
Department of Microelectronics, Brno University of Technology, Czech Republic
Abstract :
The paper is focused on influence of flux during reflow process. Smaller and lighter FBGA packages caused formation of defects. Analysis of proper soldering process of FBGA components is crucial for correct function of a device. Detection of defects after reflow process is an important part of solder joints reliability. This paper deals with particular parameters which affected yield of FBGA rework process.
Keywords :
Electronics packaging; Joints; Lead; Liquids; Reflow soldering;
Conference_Titel :
Electronics Technology (ISSE), 2015 38th International Spring Seminar on
Conference_Location :
Eger, Hungary
DOI :
10.1109/ISSE.2015.7248000
