Title :
Quality control of chip on board LED packaging by transient thermography
Author :
Andonova, A. ; Georgieva, V. ; Kim, N. ; Vakrilov, N. ; Bonev, B.
Author_Institution :
Department of Microelectronics, Technical University of Sofia, Bulgaria
Abstract :
A new methodology of infrared thermography (IRT) measurements for quality control of chip on board light emitting diode (COB LED) package is studied and presented. For this goal information measuring system and appropriate additional software is developed and used. COB LED samples are prepared with different kind of defects are prepared. Results from using some suitable IRT methods of passive-, pulsed-, lock in-, FMTWI-thermography are shown and relevant image processing methods are used and discussed.
Keywords :
Current measurement; Electronic packaging thermal management; Light emitting diodes; Packaging; Semiconductor device measurement; Temperature measurement; Three-dimensional displays;
Conference_Titel :
Electronics Technology (ISSE), 2015 38th International Spring Seminar on
Conference_Location :
Eger, Hungary
DOI :
10.1109/ISSE.2015.7248002
