DocumentCode
2123249
Title
Quality control of chip on board LED packaging by transient thermography
Author
Andonova, A. ; Georgieva, V. ; Kim, N. ; Vakrilov, N. ; Bonev, B.
Author_Institution
Department of Microelectronics, Technical University of Sofia, Bulgaria
fYear
2015
fDate
6-10 May 2015
Firstpage
261
Lastpage
266
Abstract
A new methodology of infrared thermography (IRT) measurements for quality control of chip on board light emitting diode (COB LED) package is studied and presented. For this goal information measuring system and appropriate additional software is developed and used. COB LED samples are prepared with different kind of defects are prepared. Results from using some suitable IRT methods of passive-, pulsed-, lock in-, FMTWI-thermography are shown and relevant image processing methods are used and discussed.
Keywords
Current measurement; Electronic packaging thermal management; Light emitting diodes; Packaging; Semiconductor device measurement; Temperature measurement; Three-dimensional displays;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology (ISSE), 2015 38th International Spring Seminar on
Conference_Location
Eger, Hungary
Type
conf
DOI
10.1109/ISSE.2015.7248002
Filename
7248002
Link To Document