• DocumentCode
    2123637
  • Title

    The Career Commitment of Contingent Workforce in Semiconductor Industry

  • Author

    Niu, Han-Jen ; Chang, Chao-Jung

  • Author_Institution
    Dept. of Manage. Sci. & Decision Making, Tamkang Univ., Taipei, Taiwan
  • fYear
    2009
  • fDate
    20-22 Sept. 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The growth in the number of contingent employees is one of the most important developments in the labor market in recent years. Most studies focus on regular workers´ commitment to the organization they belong. However, career commitment is the variable that describes one´s attitude toward professional development. The study examines the relationship between goal instability and career commitment in the case of contingent employees working for a client company. The study uses a survey of 124 on-site engineers in the semiconductor industry. Hiring contingent employees is an important trend in the future, and its performance will be even more important to the client company than it is today. The results conclude that the client company cannot ignore this part of the workforce at a time when market flexibility is crucial. The client company should try to reduce or eliminate on-site employees´ dissatisfaction with work circumstances if it hopes to ensure their positive attitude to work and high performance.
  • Keywords
    human factors; human resource management; personnel; professional aspects; semiconductor industry; career commitment; contingent workforce; employee dissatisfaction; employee performance; goal instability; labor market; market flexibility; positive attitude; professional development; semiconductor industry; work circumstances; worker commitment; Chaos; Companies; Contingency management; Costs; Decision making; Electronics industry; Employment; Engineering profession; Humans; Recruitment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Management and Service Science, 2009. MASS '09. International Conference on
  • Conference_Location
    Wuhan
  • Print_ISBN
    978-1-4244-4638-4
  • Electronic_ISBN
    978-1-4244-4639-1
  • Type

    conf

  • DOI
    10.1109/ICMSS.2009.5302926
  • Filename
    5302926