• DocumentCode
    2124759
  • Title

    Combination of loosely coupled and and compactly coupled integration of CAD tools and their applications in SAW devices design and fabrication

  • Author

    Li, Peigang ; Zhang, Jiaqin ; Hao, Uuquan

  • Author_Institution
    Inst. 23, Second Acad. of the China Aerospace Corp., China
  • Volume
    2
  • fYear
    1996
  • fDate
    9-12 Oct 1996
  • Firstpage
    561
  • Abstract
    This paper discusses the loosely and compactly coupled integration of CAD tools and their applications in the design and fabrication of surface acoustic wave (SAW) devices. Three core modules are developed as design and mask pattern verification module, database module, and device characteristics simulation module. All the operations are controlled under Microsoft Windows GUI interface. This leads to a reduced design/fabrication cycle, workload and cost. With the addition of a knowledge-based library for intelligent design and Lotus Notes database for distributed and networked engineering database management (EDM) and effective control of documents, a new enterprise-leveled, computer-integrated design and manufacturing system (CIDM) can be established for monolithic and hybrid device designs (not confined to SAW device only)
  • Keywords
    CAD; CAD/CAM; computer integrated manufacturing; electronic engineering computing; graphical user interfaces; knowledge based systems; surface acoustic wave devices; CAD tools; CIDM; Lotus Notes database; Microsoft Windows GUI interface; SAW device design; SAW device fabrication; computer-integrated design/manufacturing system; database module; device characteristics simulation module; hybrid device designs; intelligent design; knowledge-based library; mask pattern verification module; monolithic designs; surface acoustic wave devices; Acoustic waves; Costs; Deductive databases; Design automation; Distributed databases; Fabrication; Graphical user interfaces; Libraries; Surface acoustic wave devices; Surface acoustic waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Conference, 1996., International
  • Conference_Location
    Sinaia
  • Print_ISBN
    0-7803-3223-7
  • Type

    conf

  • DOI
    10.1109/SMICND.1996.557444
  • Filename
    557444