Title :
Probing moving charge distribution of biaxial and CESL strained PMOSFETs with body effect
Author :
Mu-Chun Wang ; Jing-Zong Jhang ; Shea-Jue Wang ; Hsin-Chia Yang ; Wen-Shiang Liao ; Ming-Feng Lu ; Guo-Wei Wu ; Chuan-Hsi Liu
Author_Institution :
Dept. of Electron. Eng., Minghsin Univ. of Sci. & Technol., Hsinchu, Taiwan
Abstract :
Using body effect to probe the inversion charge distribution is a feasible method in qualitative analysis, especially for sandwich embedded SiGe structure in nano-node semiconductor strained engineering. In this study, there were three tested (100) wafers with non-strained, compressive strained and tensile strained types. After analysis, no matter what the compressive or the tensile was, the inversion current flow for PMOSFETs mainly located in biaxial strained SiGe channel due to N-well bias. The related electrical characterizations with well biases were also exhibited.
Keywords :
Ge-Si alloys; MOSFET; etching; nanoelectronics; semiconductor materials; CESL strained PMOSFET; N-well bias; SiGe; biaxial probing moving charge distribution; biaxial strained channel; body effect; compressive strained types; contact etching stop layer; electrical characterizations; inversion charge distribution; nanonode semiconductor strained engineering; qualitative analysis; sandwich embedded structure; tensile strained types; Logic gates; MOSFET; Silicon; Silicon germanium; Strain; Substrates; Threshold voltage; CESL; Si-capping layer; biaxial strain; body effect;
Conference_Titel :
Next-Generation Electronics (ISNE), 2013 IEEE International Symposium on
Conference_Location :
Kaohsiung
Print_ISBN :
978-1-4673-3036-7
DOI :
10.1109/ISNE.2013.6512371