• DocumentCode
    2126459
  • Title

    Driving forces & the technological challenges for SOC development of tomorrow

  • Author

    Roh, Hyung-Lae

  • Author_Institution
    SOC R&D Center, Samsung Electron. Co. Ltd., Yongin, South Korea
  • fYear
    2003
  • fDate
    27-29 Aug. 2003
  • Firstpage
    2
  • Abstract
    Summary form only given, as follows. With advances in semiconductor technology where millions of transistors can be placed on a die, a complex system can be easily manufactured, and designers are now incorporating their system concepts into a single-die. System-on-chip (SOC) devices have changed the landscape of business models from the perspective of not only semiconductor vendors, but also system makers. Factors like high complexities of SOC design over deep sub-micron processes, long design turn-around time and high fabrication cost may jeopardize the success of SOC, if conventional business models and design methodologies are followed. The presentation discusses the driving forces and key challenges for SOC developments, especially the technological aspects. The presentation comprises two distinct sections. The first part is centered on the SOC market dynamics, the driving forces for SOC and SOC market trends. Based on these dynamics, the second part discusses future SOC development challenges.
  • Keywords
    integrated circuit design; integrated circuit economics; integrated circuit technology; semiconductor technology; system-on-chip; SOC design; SOC development; business models; deep sub-micron processes; design turn-around time; fabrication cost; market dynamics; semiconductor technology; semiconductor vendors; system makers; system-on-chip; Consumer electronics; Fabrication; Large scale integration; Process design; Research and development; Research and development management; Semiconductor device manufacture; System-on-a-chip; Technology management; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Processing Systems, 2003. SIPS 2003. IEEE Workshop on
  • ISSN
    1520-6130
  • Print_ISBN
    0-7803-7795-8
  • Type

    conf

  • DOI
    10.1109/SIPS.2003.1235632
  • Filename
    1235632