• DocumentCode
    2126742
  • Title

    Design of an ASIC for the ATM layer functions

  • Author

    Shin, Hyeon-sik ; Jun, Jongarm ; Kim, Jae-Geun

  • Author_Institution
    Electron. & Telecommun. Res. Inst., Taejeon, South Korea
  • Volume
    2
  • fYear
    1996
  • fDate
    5-7 May 1996
  • Firstpage
    723
  • Abstract
    This paper describes the implementation of an ASIC, called ASAH-L (ATM subscriber access handler-logical), for the ATM-layer functions to develop network equipment in B-ISDN. ASAH-L is applicable to network-network interfaces or user-network interfaces and has F4 or F5 level OAM functions with real time processing defined by ITU-TS. Also it provides QOS and network parameter processing, a feature of the OAM. The interface between the ASAH-L and the physical layer functions is the UTOPIA level-1 interface defined by ATM Forum. ASAH-L has two interfaces, 53-octet and 56-octet architecture, for the AAL or ATM switch fabric functions. We have designed all the functions using VHDL. This ASIC, based on gate-arrays, uses 240,000 gates and is packaged in a 240-pin QFP (quad flat package). It is fabricated with 0.6 micron CMOS technology
  • Keywords
    B-ISDN; CMOS logic circuits; application specific integrated circuits; asynchronous transfer mode; electronic switching systems; integrated circuit design; integrated circuit packaging; logic arrays; subscriber loops; telecommunication equipment; telecommunication standards; 0.6 micron; 53-octet architecture; 56-octet architecture; ASAH-L; ASIC; ATM layer functions; ATM subscriber access handler-logical; B-ISDN; F4 level OAM functions; F5 level OAM functions; ITU-TS; UTOPIA level-1 interface; VHDL; gate-arrays; interface; network equipment; network parameter processing; network-network interfaces; physical layer functions; quad flat package; real time processing; switch fabric function; user-network interfaces; Application specific integrated circuits; Asynchronous transfer mode; B-ISDN; CMOS technology; Costs; Electronics packaging; Fabrics; Physical layer; Relays; Resource management; Semiconductor device packaging; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communication Technology Proceedings, 1996. ICCT'96., 1996 International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    0-7803-2916-3
  • Type

    conf

  • DOI
    10.1109/ICCT.1996.544984
  • Filename
    544984