Title :
On-chip VCSEL interconnects enabled by 3-D interposer-based integration and polarization modulation
Author :
Coldren, Larry A. ; Barve, Ajit V.
Author_Institution :
Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA 93117, USA
Abstract :
Optical interconnects are required for a continued scaling of a version of Moore´s Law. VCSELs remain the most efficient sources to integrate, and these can be compatibly integrated with emerging 3-D integration technology using active interposers. Polarization-modulation can double the bisection bandwidth available together with coarse WDM and other modulation techniques.
Keywords :
Drives; Modulation; Photonics; Power generation; Temperature distribution; Vertical cavity surface emitting lasers; Wavelength division multiplexing;
Conference_Titel :
Summer Topicals Meeting Series (SUM), 2015
Conference_Location :
Nassau, Bahamas
Print_ISBN :
978-1-4799-7467-2
DOI :
10.1109/PHOSST.2015.7248241
