Abstract :
The following topics are dealt with: compound semiconductor electronics; power devices; Ethernet; GaN devices; high-power amplifier technology; millimeter wave MMIC; distributed amplifier MMIC; mixer MMIC; MMIC LNA; amplifier techniques; millimeter wave CMOS; high-speed CMOS; device modeling and characterization: high efficiency linear PA for basestations; TR modules and switches; high speed mixed signal circuits; high performance frequency generation; advanced device technologies and front-end modules and components.
Keywords :
HEMT integrated circuits; MMIC mixers; MMIC oscillators; MMIC power amplifiers; distributed amplifiers; field effect MMIC; local area networks; mixed analogue-digital integrated circuits; transceivers; Ethernet; GaN devices; MMIC LNA; TR modules; TR switches; advanced device technologies; amplifier techniques; compound semiconductor electronics; device characterization; device modeling; distributed amplifier MMIC; front-end components; front-end modules; high efficiency linear PA; high performance frequency generation; high speed mixed signal circuits; high-power amplifier technology; high-speed CMOS; millimeter wave CMOS; millimeter wave MMIC; mixer MMIC; power devices;
Conference_Titel :
Compound Semiconductor Integrated Circuit Symposium, 2007. CSIC 2007. IEEE
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4244-1022-4
DOI :
10.1109/CSICS07.2007.1
