DocumentCode :
2130103
Title :
Novel Package Technology of Ultra High Power Light-Emitting Diodes by Electroplating
Author :
Su, Y.K. ; Chen, K.C. ; Lin, C.L. ; Chuang, Ricky W. ; Huang, J.Q. ; Hsu, Hsiao Chiu
fYear :
2007
fDate :
14-17 Oct. 2007
Firstpage :
1
Lastpage :
4
Keywords :
Brightness; Conducting materials; Copper; Electronic packaging thermal management; Energy management; Heat sinks; Lead; Light emitting diodes; Thermal conductivity; Thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Compound Semiconductor Integrated Circuit Symposium, 2007. CSIC 2007. IEEE
Conference_Location :
Portland, OR, USA
Print_ISBN :
978-1-4244-1022-4
Type :
conf
DOI :
10.1109/CSICS07.2007.9
Filename :
4384389
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2130103
