DocumentCode
2131522
Title
T/R Module Packaging - a Challenge for Future System Design
Author
Bösch, Wolfgang
Author_Institution
Daimler Benz Aerospace AG, Defense and Civil Systems - Airborne Systems, wbosch@vs.dasa.de
Volume
1
fYear
1997
fDate
8-12 Sept. 1997
Firstpage
20
Lastpage
25
Abstract
Future packaging technology is driven by key parameters, such as volume and mass of the T/R module, interconnect technology and overall efficiency. These parameters and their effects on the radar system are discussed. Further, enabling techniologies to achieve performance and cost objectives are listed, an overview of European T/R module technology is given and some examples of advanced packaging technologies are presented.
Keywords
Airborne radar; Antenna arrays; Costs; Instruments; Packaging; Phased arrays; Radar antennas; Satellites; Space technology; Spaceborne radar;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 1997. 27th European
Conference_Location
Jerusalem, Israel
Type
conf
DOI
10.1109/EUMA.1997.337764
Filename
4138805
Link To Document