Innovative Multilayer Technologies for Active Phased Array Antennas

A high performance organic multilayer structure has been developed and manufactured for an active phased array antenna. The driving factors were cost reduction and high integration. To satisfy these requirements, the same multilayer structure mixing aluminum and Teflon® laminates is used as a mechanical support of microwave functions, RE and DC interconnects, power divider including planar resistors, thermal dissipator, ASIC´s and MMIC packages. Key technological developments that have been realized are planar resistors in stripline configuration using Ohmega ® Foil technology with 10% tolerance, fusion bonding multilayer technology, starting with thick aluminum backed laminates (plated through holes connected to aluminum, plated through holes unconnected to aluminum) and MMIC´s and ASIC´s integration (chips or ceramics). This approach has proved to be efficient in terms of cost and performances by reducing RF discontinuities, reducing bonding and wiring, minimizing interface parasitic, eliminating prasitic resonance and reducing coaxial connectors. Further developments are in progress: passive function integration such as filters, couplers, ... or dielectric loss reduction using suspended stripline propogation.