A miniaturized Marchand balun based on the LTCC technology

Author

Guoqing Zhang ; Jianxin Chen ; Hui Tang

Author_Institution

Sch. of Electron. & Inf., Nantong Univ., Nantong, China

fYear

2013

fDate

21-25 July 2013

Firstpage

101

Lastpage

104

Abstract

In this paper, a miniaturized multilayer Marchand balun based on low temperature co-fired ceramic (LTCC) technology is presented. By folding the broadsided coupled transmission line vertically and horizontally in the three dimensional (3-D) space, the circuit size of the balun is greatly reduced comparing to the conventional design of the balun circuits realized on the printed circuit board(PCB). A Marchand balun at 1.1GHz is designed and simulated with the whole size of 5mm×4.8mm×1.8mm.The simulation results of the design show a good performance of the balun. Thus, it can be suitable for the application of wireless communication systems.

Keywords

UHF devices; baluns; ceramic packaging; printed circuits; 3D space; LTCC technology; PCB; broadsided coupled transmission line; circuit size reduction; frequency 1.1 GHz; low temperature co-fired ceramic technology; miniaturized multilayer Marchand balun; printed circuit board; size 1.8 mm; size 4.8 mm; size 5 mm; wireless communication systems; Bluetooth; Coils; Educational institutions; Impedance matching; Noise; Ports (Computers); Marchand balun; low-temperature co-fired-ceramic (LTCC); miniaturized;

fLanguage

English

Publisher

ieee

Conference_Titel

Cross Strait Quad-Regional Radio Science and Wireless Technology Conference (CSQRWC), 2013

Conference_Location

Chengdu

Type

conf

DOI

10.1109/CSQRWC.2013.6657362

Filename

6657362