Title :
Table of contents
fDate :
May 30 2006-June 2 2006
Abstract :
The following topics are dealt with: thermal management; microchannel heat sinks; high power chips and devices; liquid cooling; spray, mist and liquid jet impingement; thermal modeling; electronics packages; thermal characterization; data centers; thermal characterization; heat pipes; thermosyphons; capillary pumped loops; vapor chambers; forced convection; natural convection; fluidic and acoustic refrigeration devices; failure mechanics and damage modeling; computational modeling; lead free solder materials; board and systems level reliability; package level reliability; 3D packaging; green packaging; nanotechnology; MEMS and sensors and space systems
Keywords :
failure analysis; heat pipes; heat sinks; heat transfer; jets; micromechanical devices; microsensors; nanotechnology; refrigeration; reliability; solders; space vehicles; sprays; thermal management (packaging); 3D packaging; MEMS; acoustic refrigeration devices; board level reliability; capillary pumped loops; computational modeling; damage modeling; data centers; electronics packages; failure mechanics; fluidic refrigeration devices; forced convection; green packaging; heat pipes; high power chips; high power devices; lead free solder materials; liquid cooling; liquid jet impingement; microchannel heat sinks; nanotechnology; natural convection; package level reliability; sensor devices; space systems; systems level reliability; thermal characterization; thermal management; thermal modeling; thermosyphons; vapor chambers;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-9524-7
DOI :
10.1109/ITHERM.2006.1645316
