DocumentCode
2133163
Title
Thermal Transport in Combined Pressure - Electroosmotically Driven Flow in Microchannels
Author
Qazizade, Azad ; Manzari, Mehrdad T. ; Hannani, Siamak K.
Author_Institution
Sch. of Mech. Eng., Sharif Univ. of Technol., Tehran
fYear
2006
fDate
May 30 2006-June 2 2006
Firstpage
63
Lastpage
70
Abstract
An analytical solution is presented to study the heat transfer characteristics of the combined pressure-electroosmotically driven flow in planar microchannels. The physical model includes the Joule heating effect to predict the convective heat transfer coefficient in two dimensional microchannels. The velocity field, which is a function of external electrical field, electroosmotic mobility, fluid viscosity and the pressure gradient, is obtained by solving the hydrodynamically fully-developed laminar Navier-Stokes equations considering the electrokinetic body force for low wall zeta potentials. Then, assuming a thermally fully-developed flow, the temperature distribution and the Nusselt number is obtained for a constant wall heat flux boundary condition. The fully-developed temperature profile and the Nusselt number depend on velocity field, channel height, solid/liquid interface properties and the imposed wall heat flux. A parametric study is presented to evaluate the significance of various parameters, and in each case the maximum heat transfer rate is obtained
Keywords
Navier-Stokes equations; electrokinetic effects; electrophoresis; heat transfer; microchannel flow; osmosis; viscosity; Joule heating effect; Nusselt number; convective heat transfer; electrokinetic body force; electroosmotic mobility; fluid viscosity; heat flux; laminar Navier-Stokes equations; microchannel flow; pressure gradient; pressure-electroosmotically driven flow; thermal transport; Boundary conditions; Electrokinetics; Heat transfer; Microchannel; Navier-Stokes equations; Predictive models; Solids; Temperature dependence; Temperature distribution; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location
San Diego, CA
ISSN
1087-9870
Print_ISBN
0-7803-9524-7
Type
conf
DOI
10.1109/ITHERM.2006.1645323
Filename
1645323
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