RF and DC multilayer: The Multi Function Concept

Future beamforming radar, especially of the phase array type, have demanding requirements on integration of RF antenna, transmit and receive functions. This paper describes a novel type of printed circuit board (PCB), combining highly integrated analog and digital circuitry on one side, and on the other side both active (e.g. MMIC´s) and passive RF antenna components (e.g. radiating elements). The paper addresses the requirements for such a board both from a performance point of view and from an industrial point of view. A complex multilayer board including a microstrip transmission line, stripline for RF and 4 DC layers is described. This paper indicates cost issues. Further developments of this type of board design and opportunities for application in telecom domain are identified. An example of the manufactured board will be demonstrated at the conference.