Title :
Thermal Analysis for Microprocessor Sockets
Author :
Song, David W. ; Gupta, Ashish ; Chiu, Chia-Pin
Author_Institution :
Assembly Technol. Dev., Design Process Dev., Chandler, AZ
fDate :
May 30 2006-June 2 2006
Abstract :
This paper presents the progress in the ongoing methodology development of the thermal analysis of high-current microprocessor sockets. The thermal analysis uses both experimental validation and a finite-element model of a single socket pin. A 25-pin socket pin model is also studied, which shows the thermal impact of non-uniformity of current-per-pin distribution in socket
Keywords :
finite element analysis; heating; microprocessor chips; thermal analysis; electrical self-heating; finite-element model; microprocessor sockets; socket pins; thermal analysis; Contacts; Current distribution; Electric resistance; Finite element methods; Heating; Microprocessors; Packaging; Risk management; Sockets; Temperature measurement;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-9524-7
DOI :
10.1109/ITHERM.2006.1645332
