Title :
Rackmount Liquid Cooler
Author :
Pfahnl, Andreas C.
Author_Institution :
Amphenol TCS, Nashua, NH
fDate :
May 30 2006-June 2 2006
Abstract :
A novel rack-mount liquid cooler is described that is specifically architected for electronics cooling. This non-refrigerated liquid cooling system enables compact electronics packaging by transporting the heat to a rack location where it is easier to dissipate the heat. An experimental performance assessment demonstrates the cooler in a 3RU form factor is capable of dissipating 1kW of heat with a non-electrically conducting fluid
Keywords :
cooling; electronics packaging; heat exchangers; 1 kW; 3RU form factor; electronics cooling; heat dissipation; heat transfer; rackmount liquid cooler; Acceleration; Consumer electronics; Electronics cooling; Electronics packaging; Energy consumption; Heat transfer; Liquid cooling; Prototypes; Refrigeration; Temperature;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-9524-7
DOI :
10.1109/ITHERM.2006.1645336
