• DocumentCode
    2133588
  • Title

    Tubing Selection for Sealed-for-Life Liquid Cooling Units for Electronics

  • Author

    Valdez, Frank A.

  • Author_Institution
    Fluid Syst. Div., Cooper Stand. Automotive, Auburn Hills, MI
  • fYear
    2006
  • fDate
    May 30 2006-June 2 2006
  • Firstpage
    167
  • Lastpage
    174
  • Abstract
    Sealed for life, closed loop, liquid cooling units are the next step in the evolution of chip cooling for desktop computers. This application requires that sufficient coolant fluid be circulating through the unit over its entire life span. Evaporative losses will account for the majority of fluid loss over time. The ideal tubing solution needs to be flexible, nonflammable, and have a permeation rate that will ensure a sufficient fluid level for the target life of the computer. The development of a tubing solution has led to the use of fluorinated ethylene propylene, FEP, for the tubing material. The unique molecular properties of this copolymer have proven capable of providing the high level of water permeation resistance required for sealed cooling units. This tubing has been validated for providing the low level of evaporative coolant loss necessary to support a minimum 7 year system life. FEP is rated as nonflammable (UL 94 V-0) and has a limiting oxygen index greater than 95. The high strength bonds in the FEP molecule also give it excellent chemical, UV, and ozone resistance
  • Keywords
    cooling; microcomputers; polymer blends; chip cooling; coolant fluid; copolymers; desktop computers; fluorinated ethylene propylene; sealed-for-life liquid cooling; tubing selection; water permeation resistance; Application software; Automotive engineering; Chemicals; Coolants; Electronics cooling; Hydrogen; Liquid cooling; Polymers; Solvents; Water;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    0-7803-9524-7
  • Type

    conf

  • DOI
    10.1109/ITHERM.2006.1645339
  • Filename
    1645339