Title :
Thermal Optimization of a Radial Folded Fin Heat Sink for Desktop Computer Applications
Author :
Dehoff, Bob ; Wang, Chong-Sheng ; Fast, David
Author_Institution :
Tyco Electron., North Attleboro, MA
fDate :
May 30 2006-June 2 2006
Abstract :
The continual development of faster desktop computers being sold at lower prices into the market place has demanded that thermal management engineers develop and optimize thermal management devices that not only perform better, but are at the same or lower cost than previous generations. The ever shrinking form factor has also increased the burden placed on today´s thermal management devices. CFD analysis was used to fully optimize, both cost and thermal performance, a radial folded fin heat sink design to solve today´s thermal management requirements. Modeling considerations and prototype test verifications are presented in determining the optimal thermal design characteristics, namely, fin density, fin thickness, fin style and core diameter
Keywords :
computational fluid dynamics; heat conduction; heat sinks; microcomputers; thermal analysis; thermal management (packaging); CFD analysis; desktop computer applications; fin density; fin style; fin thickness; radial folded fin heat sink; thermal analysis; thermal management devices; thermal optimization; thermal resistance; Computational fluid dynamics; Computer applications; Cost function; Design optimization; Engineering management; Heat sinks; Performance analysis; Thermal engineering; Thermal factors; Thermal management;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-9524-7
DOI :
10.1109/ITHERM.2006.1645362