Title :
Numerical Simulation of Phase Change Heat Transfer in PCM-Encapsulated Heat Sinks
Author :
Liu, Beimin ; Majumdar, Pradip
Author_Institution :
Dept. of Mech. Eng., Northern Illinois Univ., DeKalb, IL
fDate :
May 30 2006-June 2 2006
Abstract :
An enthalpy-based computational model is developed for analyzing PCM-encapsulated heat sinks for electronics chips. Solution is obtained by developing a control volume-based finite difference code and results are validated by comparing results with an analytical solution for a limiting case problem. Results based on a parametric study indicate that the two-dimensional code developed for this study can be used in evaluating PCM, and selecting geometrical dimensions of the PCM encapsulated heat sink
Keywords :
encapsulation; enthalpy; finite difference methods; heat sinks; heat transfer; phase change materials; PCM-encapsulated heat sinks; electronic chips; enthalpy; geometrical dimensions; phase change heat transfer; phase change material; volume-based finite difference code; Conducting materials; Heat engines; Heat sinks; Heat transfer; Numerical simulation; Phase change materials; Solids; Space heating; Temperature; Thermal conductivity;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-9524-7
DOI :
10.1109/ITHERM.2006.1645363
