Modeling of Multichip Module Interconnections by the TLM Method and System Identification

We present a method for computer aided generation of lumped element equivalent circuits for linear reciprocal distributed microwave circuits. The method is based on a field theoretical analysis of the distributed mrultiport circuit by the three-dimensional Transmission-Line-Matrix method. It allows to generate the topology as well as the parameters of the lumped element equivalent circuit. System identification techniques are used for the extraction of approximated admittance parameters describing the essential multiport characteristics. By Foster decomposition of the admittance matrices canonical equivalent circuit models are generated. Two examples are given to verify the proposed method and demonstrate their application to the modeling of multichip module (MCM) interconnections.