• DocumentCode
    2134577
  • Title

    An optimal approach with genetic algorithm for thermal performance of heat sink/TEC assembly

  • Author

    Peng, C.H. ; Wu, M.C. ; Horng, J.T. ; Lee, C.Y. ; Fang, C.J. ; Hung, Y.H.

  • Author_Institution
    Dept. of Power Mech. Eng., National Tsing Hua Univ., Hsinchu
  • fYear
    2006
  • fDate
    May 30 2006-June 2 2006
  • Lastpage
    463
  • Abstract
    In the present study, a semi-empirical method that combines theoretical and experimental data for exploring the thermal performance of a heat sink with or without integrating TEC has been successfully established. By employing the genetic optimization technique, a series of constrained optimal designs have been performed. The independent variables for optimization search are the pumping capacity of the TEC (Q c), the electric current of the TEC (I) and the external thermal resistance between hot side of the TEC and ambient (Rext ). The present objective for the optimization search is the maximum temperature difference between heat sinks with and without integrating TEC. The results show that optimal value of DeltaTb-c is 21.3degC, with boundary limits of Qc =10W, I=10A and Rext=0.25 degC/W. However, this design results in a poor coefficient of performance (COP), say COP=0.17. Under a given constraint of COPsquare2, the optimal value of DeltaTb-c can be obtained to be 9.1 degC with the corresponding Qc=14.8W, I=3.4A and Rext=0.25degC/W. Comparisons between the results by the present optimal design and those obtained by the semi-empirical method have been made with a satisfactory agreement. The present optimal design shows that a heat sink/TEC assembly can provide an effective temperature reduction with high COP and extend the upper limits of air-cooled heat sinks
  • Keywords
    assembling; genetic algorithms; heat sinks; thermal management (packaging); 10 A; 10 W; 14.8 W; 21.3 C; 3.4 A; 9.1 C; TEC assembly; air-cooled heat sinks; electric current; external thermal resistance; genetic algorithm; genetic optimization; heat sink assembly; temperature reduction; thermal performance; Assembly; Electric resistance; Genetic algorithms; Heat engines; Heat sinks; Temperature; Thermal conductivity; Thermal engineering; Thermal management of electronics; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    0-7803-9524-7
  • Type

    conf

  • DOI
    10.1109/ITHERM.2006.1645379
  • Filename
    1645379