• DocumentCode
    2135054
  • Title

    Heat transport characteristics of the capillary pumped loop for cooling the tower-type computer -2nd report: considering the inclination of the evaporator-

  • Author

    Tsujimori, Atsushi ; Kato, Masashi ; Uchida, Maiko

  • Author_Institution
    Dept. of Mech. Eng., Kanto Gakuin Univ., Kanagawa
  • fYear
    2006
  • fDate
    May 30 2006-June 2 2006
  • Firstpage
    563
  • Lastpage
    569
  • Abstract
    The capillary pumped loop has been widely investigated for a space thermal control device. This cooling device with high reliability and thermal controllability is considered to be suited to cool the electronic device like a tower-type personal computer, because the capillary pumped loop is good for absorbing heat from high heat flux region like a CPU, transporting it and releasing it from the large surface area like a packaging of the tower-type computer. In this study the capillary pumped loop was manufactured as a cooling device for the tower-type personal computer, and the heat transport characteristics was investigated. The experimental equipment consisted of the evaporator, the condenser, the liquid path and the vapor path. The heat transport length was set to 2500mm considering the air-cooled heat release area of the condenser. In the 1st report the effect of the wick dimension, cooling water temperature, evaporator height above the condenser were investigated. In this study, the influence of the inclination of the evaporator on the heat transport characteristics was mainly investigated. In results, this capillary pumped loop was able to work within the inclined angle of 20deg, but the maximum heat transport rate decreased as the inclination increased
  • Keywords
    cooling; microcomputers; thermal management (packaging); air-cooled heat release area; capillary pumped loop; condenser; cooling device; evaporator height; heat transport characteristics; heat transport length; heat transport rate; liquid path; tower-type personal computer; vapor path; Electronic packaging thermal management; Electronics cooling; Electronics packaging; Heat pumps; Heat transfer; Microcomputers; Refrigerants; Resistance heating; Space cooling; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1087-9870
  • Print_ISBN
    0-7803-9524-7
  • Type

    conf

  • DOI
    10.1109/ITHERM.2006.1645395
  • Filename
    1645395