DocumentCode :
2135144
Title :
Effects of pin-finned condensing surfaces on pool boiling in FC-72
Author :
Karng, Sarng Woo ; Ji, Tae Ho ; Kim, Seo Young
Author_Institution :
Thermal/Flow Control Res. Center, KIST, Seoul
fYear :
2006
fDate :
May 30 2006-June 2 2006
Firstpage :
586
Lastpage :
590
Abstract :
In the present study, the boiling of FC-72 occurs from a smooth boiling surface (14 times 14 mm2) and its vapor is condensed by four different types of condensing surfaces (30 times 30 mm2 base): a smooth surface and 1times1 mm2 pin-finned surfaces of 2 mm high with 0.3 mm, 0.5 mm, and 1 mm array spacing. Boiling characteristics are investigated in detail for different condensing surfaces. For a smooth boiling surface, the results obtained display that the pin-finned condensing surface with 1 mm array spacing yields the best performance and the smooth condensing surface does the worst. Furthermore hysteresis phenomenon is substantially reduced by using the enhanced condensing surfaces
Keywords :
boiling; condensation; cooling; electronics packaging; 0.3 to 1 mm; 2 mm; FC-72 boiling; boiling characteristics; hysteresis phenomenon; pin-finned condensing surfaces; pool boiling; smooth boiling surface; Displays; Electronic components; Electronics cooling; Electronics industry; Heat transfer; Hysteresis; Mechanical engineering; Temperature; Testing; Thermal engineering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location :
San Diego, CA
ISSN :
1087-9870
Print_ISBN :
0-7803-9524-7
Type :
conf
DOI :
10.1109/ITHERM.2006.1645398
Filename :
1645398
Link To Document :
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