Title :
Thermal management of a stacked-die package in a handheld electronic device using passive solutions
Author :
Moon, Sung-Won ; Prstic, Suzana ; Chiu, Chia-Pin
Author_Institution :
Assembly Technol. Dev., Intel Corp., Chandler, CA
fDate :
May 30 2006-June 2 2006
Abstract :
Various passive thermal management schemes are discussed for a high power component in a handheld electronic device. The validated package and system thermal model based on JEDEC standards and a cell phone mock-up testing were used for the extensive analysis. Also the empirical data was collected to validate thermal improvement predicted by CFD analysis. By using the validated thermal model, the design cycle and time-to-market can be significantly reduced
Keywords :
computational fluid dynamics; cooling; mobile handsets; thermal management (packaging); CFD analysis; JEDEC standards; cell phone mock-up testing; electronic cooling; handheld electronic device; passive thermal management schemes; stacked-die package; system level model; thermal modeling; Cellular phones; Computational fluid dynamics; Electronic packaging thermal management; Energy management; Power system management; Power system modeling; System testing; Thermal management; Thermal management of electronics; Time to market;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-9524-7
DOI :
10.1109/ITHERM.2006.1645428
