Title :
Development of ball impact test system
Author :
Yeh, Chang-Lin ; Lai, Yi-Shao
Author_Institution :
Stress-Reliability Lab., Adv. Semicond. Eng., Inc., Kaohsiung
fDate :
May 30 2006-June 2 2006
Abstract :
We introduce in this paper background and development of the high-speed ball shear test systems, in particular a specific ball impact test system. Measured impact force profiles and corresponding structural dynamics calibrations are provided for the understanding of characteristics of this particular package-level test methodology as well as transient structural responses of solder joints subjected to impact loads. A design guideline for the ball impact test apparatus is also proposed
Keywords :
calibration; electron device testing; electronics packaging; impact testing; test equipment; test facilities; IMC; ball impact test system; ball shear test systems; impact force profiles; intermetallic compound; package-level test methodology; solder joint; structural dynamics; Damping; Force measurement; Intermetallic; Packaging; Semiconductor device testing; Soldering; Strain measurement; System testing; Vehicle dynamics; Vehicles;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-9524-7
DOI :
10.1109/ITHERM.2006.1645463
