DocumentCode
2137102
Title
Development of ball impact test system
Author
Yeh, Chang-Lin ; Lai, Yi-Shao
Author_Institution
Stress-Reliability Lab., Adv. Semicond. Eng., Inc., Kaohsiung
fYear
2006
fDate
May 30 2006-June 2 2006
Firstpage
1070
Lastpage
1076
Abstract
We introduce in this paper background and development of the high-speed ball shear test systems, in particular a specific ball impact test system. Measured impact force profiles and corresponding structural dynamics calibrations are provided for the understanding of characteristics of this particular package-level test methodology as well as transient structural responses of solder joints subjected to impact loads. A design guideline for the ball impact test apparatus is also proposed
Keywords
calibration; electron device testing; electronics packaging; impact testing; test equipment; test facilities; IMC; ball impact test system; ball shear test systems; impact force profiles; intermetallic compound; package-level test methodology; solder joint; structural dynamics; Damping; Force measurement; Intermetallic; Packaging; Semiconductor device testing; Soldering; Strain measurement; System testing; Vehicle dynamics; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on
Conference_Location
San Diego, CA
ISSN
1087-9870
Print_ISBN
0-7803-9524-7
Type
conf
DOI
10.1109/ITHERM.2006.1645463
Filename
1645463
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