Title :
Improving puncher efficiency using a double-loop traveling salesman problem
Author :
Xiao-Dong Wang ; Jun Feng ; Bo-ting Qu ; Jia-rong Wang ; Zhen Zan
Author_Institution :
Sch. of Inf. & Technol., Northwest Univ., Xi´an, China
Abstract :
Making the via holes is an important component part in the production of the printed circuit board. Therefore, how to improve the production efficiency of the puncher is a valuable research topic. In the paper, a novel mathematical model is built for the printed circuit board. Further more, we propose a novel method to solve the novel mathematical model. Furthermore, an improved double loop TSP model with the multiple constraint conditions is employed to solve the improving problem of the production efficiency. The experimental results show that our model can effectively improve the production efficiency of the puncher and the proposed method is more effectively than other traditional algorithms.
Keywords :
mathematical analysis; printed circuit manufacture; production management; travelling salesman problems; double loop TSP model; double-loop traveling salesman problem; mathematical model; multiple constraint conditions; printed circuit board production; puncher production efficiency; Educational institutions; Genetic algorithms; Heuristic algorithms; Mathematical model; Production; Simulated annealing; Equivalent network diagram; Floyd; Genetic algorith; Traveling salesman problem;
Conference_Titel :
Natural Computation (ICNC), 2013 Ninth International Conference on
Conference_Location :
Shenyang
DOI :
10.1109/ICNC.2013.6818085