DocumentCode
2138495
Title
Trends of key advanced device technologies
Author
Hwang, B. Chester
Author_Institution
Motorola Inc., USA
fYear
1997
fDate
15-16 Sep 1997
Firstpage
78
Lastpage
81
Abstract
Silicon CMOS technology has followed Moore´s law over the past two decodes. It is still on the predicted curve, and it appears that the trend will continue into the next decade. The SIA roadmap published by Sematech in 1994 predicted the progress of semiconductor technology fairly well. Expectations based on the SIA roadmap are now being exceeded; for example, as announced by many companies, the projected 0.25 μm production in 1998 will be met in 1997. Other technologies continue to make progress, along with silicon CMOS technology. The distinctive ones are Thin Film Silicon on insulator (TFSOI), Complementary Gallium Arsenide (CGaAs), and Graded-Channel CMOS (GCMOS). This paper will discuss the status, potential and hurdles of these technologies
Keywords
CMOS integrated circuits; economics; integrated circuit manufacture; integrated circuit technology; silicon-on-insulator; space vehicle electronics; technological forecasting; 0.25 micron; CMOS technology; GaAs; Moore´s law; SIA roadmap; Sematech; Si; TFSOI; complementary IC technology; graded-channel CMOS; CMOS process; CMOS technology; Gallium arsenide; Moore´s Law; Production; Radio frequency; Semiconductor device manufacture; Semiconductor thin films; Silicon on insulator technology; Space technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Research in VLSI, 1997. Proceedings., Seventeenth Conference on
Conference_Location
Ann Arbor, MI
Print_ISBN
0-8186-7913-1
Type
conf
DOI
10.1109/ARVLSI.1997.634847
Filename
634847
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