• DocumentCode
    2138770
  • Title

    Design implementation of intrinsic area array ICs

  • Author

    Tan, Chandra ; Bouldin, Donald ; Dehkordi, Peyman

  • Author_Institution
    Dept. of Electr. Eng., Tennessee Univ., Knoxville, TN, USA
  • fYear
    1997
  • fDate
    15-16 Sep 1997
  • Firstpage
    82
  • Lastpage
    93
  • Abstract
    Arranging I/O in a matrix array over the core circuitry of an IC generally provides 5-10 times more I/O than the traditional method of restricting pads to the periphery. This approach also minimizes overall die size. This method was pioneered by IBM over thirty years ago and has recently become attractive for new designs requiring several hundred I/O. In this paper we describe the development of a new area-array pad router which differs from other approaches in that no additional metal layer is added (unless needed) and no redistribution is required. We describe the design guideline definition, data preparation, pad placement, pad assignment, pad routing, and output padframe generation of this technique. The results of applying this router are shown for sample designs requiring 112, 298 and 485 I/Os
  • Keywords
    circuit layout CAD; flip-chip devices; integrated circuit design; network routing; core circuitry; data preparation; intrinsic area array ICs; matrix array; output padframe generation; overall die size; pad assignment; pad placement; pad router; pad routing; Assembly; Bonding; Design automation; Electronics packaging; Guidelines; Integrated circuit layout; Integrated circuit packaging; Military computing; Operating systems; Routing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Research in VLSI, 1997. Proceedings., Seventeenth Conference on
  • Conference_Location
    Ann Arbor, MI
  • Print_ISBN
    0-8186-7913-1
  • Type

    conf

  • DOI
    10.1109/ARVLSI.1997.634848
  • Filename
    634848