DocumentCode
2138770
Title
Design implementation of intrinsic area array ICs
Author
Tan, Chandra ; Bouldin, Donald ; Dehkordi, Peyman
Author_Institution
Dept. of Electr. Eng., Tennessee Univ., Knoxville, TN, USA
fYear
1997
fDate
15-16 Sep 1997
Firstpage
82
Lastpage
93
Abstract
Arranging I/O in a matrix array over the core circuitry of an IC generally provides 5-10 times more I/O than the traditional method of restricting pads to the periphery. This approach also minimizes overall die size. This method was pioneered by IBM over thirty years ago and has recently become attractive for new designs requiring several hundred I/O. In this paper we describe the development of a new area-array pad router which differs from other approaches in that no additional metal layer is added (unless needed) and no redistribution is required. We describe the design guideline definition, data preparation, pad placement, pad assignment, pad routing, and output padframe generation of this technique. The results of applying this router are shown for sample designs requiring 112, 298 and 485 I/Os
Keywords
circuit layout CAD; flip-chip devices; integrated circuit design; network routing; core circuitry; data preparation; intrinsic area array ICs; matrix array; output padframe generation; overall die size; pad assignment; pad placement; pad router; pad routing; Assembly; Bonding; Design automation; Electronics packaging; Guidelines; Integrated circuit layout; Integrated circuit packaging; Military computing; Operating systems; Routing;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Research in VLSI, 1997. Proceedings., Seventeenth Conference on
Conference_Location
Ann Arbor, MI
Print_ISBN
0-8186-7913-1
Type
conf
DOI
10.1109/ARVLSI.1997.634848
Filename
634848
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