Thermally enhanced plastic packages using diamond for microwave applications

Author

Gomes-Casseres, M. ; Fabis, P.M.

Author_Institution

Sanders Associates Inc., Nashua, NH, USA

Volume

1

fYear

1996

fDate

17-21 June 1996

Firstpage

227

Abstract

Superior material properties of CVD combined with the economics of plastic provide an improved thermal management solution for microwave packages. The thermomechanical issues of attaching Gallium Arsenide devices to diamond have been investigated. Results indicate that a 43% decrease in maximum junction temperature and a 10/sup 6/ increase in mean time between failure has been achieved. In addition, an insertion loss of <1.5 dB and a VSWR of 1.5:1 was achieved for a 1 inch long 50 /spl Omega/ coplanar transmission line up to 20 GHz.

Keywords

CVD coatings; III-V semiconductors; MMIC; diamond; gallium arsenide; integrated circuit packaging; plastic packaging; 1.5 dB; 20 GHz; C; CVD; GaAs; VSWR; coplanar transmission line; diamond; gallium arsenide MMICs; insertion loss; junction temperature; mean time between failure; microwave packages; plastic packages; thermal management; thermomechanical analysis; Gallium arsenide; Insertion loss; Joining processes; Material properties; Microwave devices; Plastic packaging; Propagation losses; Temperature; Thermal management; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1996., IEEE MTT-S International

Conference_Location

San Francisco, CA, USA

ISSN

0149-645X

Print_ISBN

0-7803-3246-6

Type

conf

DOI

10.1109/MWSYM.1996.508499

Filename

508499