DocumentCode
2138803
Title
Solder free interconnects for mixed signal (DC/microwave) systems
Author
Strack, D. ; Fudem, H. ; Kuss, F. ; Marsh, W. ; Costello, J.
Author_Institution
Westinghouse Electr. Corp., Baltimore, MD, USA
Volume
1
fYear
1996
fDate
17-21 June 1996
Firstpage
231
Abstract
A method of achieving high density interconnections is demonstrated through the use of solder free interconnects, between multilayer substrates in which a common technology can be used for both microwave and DC interconnects of large electronic systems.
Keywords
integrated circuit interconnections; microwave integrated circuits; DC systems; high density interconnections; microwave systems; mixed signal electronic systems; multilayer substrates; solder free interconnects; Ceramics; Coaxial components; Costs; Dielectrics; Electronics packaging; Logic arrays; Logic design; Microwave theory and techniques; Nonhomogeneous media; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1996., IEEE MTT-S International
Conference_Location
San Francisco, CA, USA
ISSN
0149-645X
Print_ISBN
0-7803-3246-6
Type
conf
DOI
10.1109/MWSYM.1996.508500
Filename
508500
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