Title :
2006 Proceedings. 56th Electronic Components & Technology Conference (IEEE Cat. No. 06CH37766C)
fDate :
May 30 2006-June 2 2006
Abstract :
The following topics are dealt with: flip chip; drop/impact reliability; innovated interconnects and processes; nanotechnology; electrical systems; lead free solders; advanced substrates; advanced packages reliability; wafer level and 3D interconnects; shock, vibration and transient bending; flip chip underfills and encapsulants; integrated RF components; wafer level packaging; test and qualification methods; bump electromigration and reliability; biotechnology; modeling of Cu-low K, 3D packaging, lead-free solders; optical interconnects; lead free interconnects reliability; advanced adhesives; advanced assembly processing for chip stacking packages; low cost/light source manufacturing; MEMS; lead free characterization; next generation first level interconnects; electrical modeling and characterization; materials and manufacturing of 3D packages; RF modules and systems; SiP/SoP; encapsulated microelectronics reliability; board-level interconnects; passives and substrates; high speed/transceivers; and low-K assembly packaging processes
Keywords :
adhesives; biotechnology; electromigration; electronics packaging; encapsulation; flip-chip devices; integrated circuit interconnections; microassembling; micromechanical devices; nanotechnology; optical interconnections; reliability; solders; system-in-package; 3D interconnects; 3D packaging; MEMS; RF modules; advanced adhesives; advanced assembly processing; advanced packages reliability; advanced substrates; biotechnology; board level interconnects; bump electromigration; chip stacking packages; drop reliability; electrical characterization; electrical modeling; encapsulated microelectronics; flip chip encapsulants; flip chip underfills; high speed transceivers; impact reliability; integrated RF components; lead free characterization; lead free interconnects reliability; lead free solders; light source manufacturing; nanotechnology; optical interconnects; transient bending; wafer level packaging;
Conference_Titel :
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-0152-6
DOI :
10.1109/ECTC.2006.1645613
