DocumentCode
2138897
Title
Millimeter-wave performance of chip interconnections using wire bonding and flip chip
Author
Krems, T. ; Haydl, W. ; Massler, H. ; Rudiger, J.
Author_Institution
Fraunhofer Inst. for Appl. Solid State Phys., Freiburg, Germany
Volume
1
fYear
1996
fDate
17-21 June 1996
Firstpage
247
Abstract
The performances of two different interconnection techniques for coplanar MMICs, wire bonding and flip chip, are investigated at millimeter-wave frequencies. By developing an accurate model for the interconnections, which is validated with experimental data up to 120 GHz, the limitations with respect to frequency and interconnection distance of either technique are pointed out, yielding useful data for the design of hybrid MMW-subsystems.
Keywords
MIMIC; MMIC; coplanar waveguides; flip-chip devices; integrated circuit interconnections; lead bonding; losses; 120 GHz; CPW; EHF; MM-wave performance; chip interconnections; coplanar MMICs; flip chip; frequency limitations; interconnection distance; millimeter-wave frequencies; model; wire bonding; Bonding; Coplanar waveguides; Dielectric substrates; Flip chip; Frequency estimation; Integrated circuit interconnections; MMICs; Millimeter wave technology; Transmission line theory; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1996., IEEE MTT-S International
Conference_Location
San Francisco, CA, USA
ISSN
0149-645X
Print_ISBN
0-7803-3246-6
Type
conf
DOI
10.1109/MWSYM.1996.508504
Filename
508504
Link To Document