Title :
Millimeter-wave performance of chip interconnections using wire bonding and flip chip
Author :
Krems, T. ; Haydl, W. ; Massler, H. ; Rudiger, J.
Author_Institution :
Fraunhofer Inst. for Appl. Solid State Phys., Freiburg, Germany
Abstract :
The performances of two different interconnection techniques for coplanar MMICs, wire bonding and flip chip, are investigated at millimeter-wave frequencies. By developing an accurate model for the interconnections, which is validated with experimental data up to 120 GHz, the limitations with respect to frequency and interconnection distance of either technique are pointed out, yielding useful data for the design of hybrid MMW-subsystems.
Keywords :
MIMIC; MMIC; coplanar waveguides; flip-chip devices; integrated circuit interconnections; lead bonding; losses; 120 GHz; CPW; EHF; MM-wave performance; chip interconnections; coplanar MMICs; flip chip; frequency limitations; interconnection distance; millimeter-wave frequencies; model; wire bonding; Bonding; Coplanar waveguides; Dielectric substrates; Flip chip; Frequency estimation; Integrated circuit interconnections; MMICs; Millimeter wave technology; Transmission line theory; Wire;
Conference_Titel :
Microwave Symposium Digest, 1996., IEEE MTT-S International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-3246-6
DOI :
10.1109/MWSYM.1996.508504
