Title :
A Novel Microstrip to Coplanar Waveguide Transition for Flip-Chip Interconnection using Electromagnetic Coupling
Author :
Kim, Juno ; Itoh, Tatsuo
Author_Institution :
Department of Electrical Engineering, University of California, Los Angeles, 405 Hilgard Ave, Los Angeles, CA 90095, USA. Phone: (310) 206-4820, Fax: (310) 206-4819
Abstract :
A novel compact microstrip to coplanar waveguide (CPW) transition is proposed for flip-chip interconnection. Broadband performance of the transition is simulated and agrees well with measured results. A good interconnection between microstrip line on a motherboard to CPW on a flip-chip is accomplished without any vias. For 10dB return loss, the microstrip-to-CPW transition and the microstrip-to-flip-chip interconnection present 170% and 140% bandwidth, respectively.
Keywords :
Bandwidth; Coplanar waveguides; Electromagnetic coupling; Electromagnetic heating; Electromagnetic waveguides; Finite difference methods; Integrated circuit interconnections; Microstrip; Time domain analysis; Waveguide transitions;
Conference_Titel :
Microwave Conference, 1998. 28th European
Conference_Location :
Amsterdam, Netherlands
DOI :
10.1109/EUMA.1998.337993