DocumentCode
2139059
Title
A Novel Microstrip to Coplanar Waveguide Transition for Flip-Chip Interconnection using Electromagnetic Coupling
Author
Kim, Juno ; Itoh, Tatsuo
Author_Institution
Department of Electrical Engineering, University of California, Los Angeles, 405 Hilgard Ave, Los Angeles, CA 90095, USA. Phone: (310) 206-4820, Fax: (310) 206-4819
Volume
1
fYear
1998
fDate
Oct. 1998
Firstpage
236
Lastpage
240
Abstract
A novel compact microstrip to coplanar waveguide (CPW) transition is proposed for flip-chip interconnection. Broadband performance of the transition is simulated and agrees well with measured results. A good interconnection between microstrip line on a motherboard to CPW on a flip-chip is accomplished without any vias. For 10dB return loss, the microstrip-to-CPW transition and the microstrip-to-flip-chip interconnection present 170% and 140% bandwidth, respectively.
Keywords
Bandwidth; Coplanar waveguides; Electromagnetic coupling; Electromagnetic heating; Electromagnetic waveguides; Finite difference methods; Integrated circuit interconnections; Microstrip; Time domain analysis; Waveguide transitions;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 1998. 28th European
Conference_Location
Amsterdam, Netherlands
Type
conf
DOI
10.1109/EUMA.1998.337993
Filename
4139080
Link To Document