• DocumentCode
    2139106
  • Title

    Integration of laser control technology with i-GLV to directly image high-resolution patterns for advanced 3D packaging

  • Author

    Matsui, H. ; Kawamura, N. ; Snow, J.

  • Author_Institution
    Dainippon Screen Manuf. Co., Ltd., Kyoto, Japan
  • fYear
    2012
  • fDate
    20-20 April 2012
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    A recently developed optical-write tool, incorporating a high-output laser with integrated grating light valve (i-GLV), has successfully been used to directly image high-resolution patterns useful for three-dimensional packaging schemes. This technology thus eliminates the need for masks for pattern creation. Automatic correction for any warpage from ultra-thin wafers is performed using a proprietary imaging technology. Different levels of dose intensity can be imaged on the resist in one exposure.
  • Keywords
    integrated circuit packaging; light valves; masks; three-dimensional integrated circuits; advanced 3D packaging; dose intensity level; high-output laser; high-resolution pattern; i-GLV; integrated grating light valve; laser control technology; optical-write tool; three-dimensional packaging scheme; ultra-thin wafer; Adaptive optics; Lasers; Optical distortion; Packaging; Resists; Three dimensional displays; Through-silicon vias; 3D packaging; GLV; TSV; direct write;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics and Electron Devices (WMED), 2012 IEEE Workshop on
  • Conference_Location
    Boise, ID
  • ISSN
    1947-3834
  • Print_ISBN
    978-1-4577-1735-2
  • Type

    conf

  • DOI
    10.1109/WMED.2012.6202615
  • Filename
    6202615