DocumentCode :
2139139
Title :
3D Active Modules for High Integration Active Antennas
Author :
Ulian, Patrice ; Monfraix, Philippe ; George, Sebastien ; Tronche, Christian ; Drevon, Claude ; Cazaux, Jean-Louis
Author_Institution :
ALCATEL SPACE, 26 avenue J-F Champollion, 31037 TOULOUSE, FRANCE
Volume :
1
fYear :
1998
fDate :
Oct. 1998
Firstpage :
271
Lastpage :
276
Abstract :
This paper describes the different parts of active antenna sub-systems currently developed in Alcatel Espace. These modules are realized according to some new 3D RF packaging technologies, mainly based on moulding assembly.
Keywords :
Aerospace industry; Antenna measurements; Assembly; Dielectric loss measurement; Integrated circuit interconnections; Low earth orbit satellites; Radio frequency; Space technology; Vehicles; Wideband;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 1998. 28th European
Conference_Location :
Amsterdam, Netherlands
Type :
conf
DOI :
10.1109/EUMA.1998.337999
Filename :
4139086
Link To Document :
بازگشت