DocumentCode
2139169
Title
Flip Chip and TAB Interconnects for Millimeter Wave MMICs a Comprehensive Study
Author
Dravet, Alain ; Desplan, Didier ; Haese, Nathalie ; Rolland, Pierre Alain
Author_Institution
Dassault Electronique, 55 Quai Marcel Dassault - 92214 SAINT CLOUD - France. E.mail: Alain.Dravet@dassault-elec.fr
Volume
1
fYear
1998
fDate
Oct. 1998
Firstpage
277
Lastpage
282
Abstract
This paper presents simulation results performed with a 3D FEM Software on flip chip and tape automated bonding interconnect of MMICs at millimeter wave frequencies (40 - 60 Ghz). Parasitic propagation modes for CPW flip chip mounted MMICs are pointed out with proposed solution. Measurement results obtained with LNA 38 and 55 GHz microstrip MMICs connected to alumina substrates with a 50 ¿ coplanar tape are presented and show goodagreement compared to bare MMICs and to simulations.
Keywords
Bonding; Coplanar waveguides; Flip chip; Frequency; MMICs; Microstrip; Millimeter wave measurements; Millimeter wave propagation; Semiconductor device measurement; Software performance;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 1998. 28th European
Conference_Location
Amsterdam, Netherlands
Type
conf
DOI
10.1109/EUMA.1998.338000
Filename
4139087
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