Micro impact characterisation of solder joint for drop impact application

Author

Wong, E.H. ; Mai, Y.-W. ; Rajoo, R. ; Tsai, K.T. ; Liu, F. ; Seah, S.K.W. ; Yeh, C.-L.

Author_Institution

Inst. of Microelectron., Singapore

fYear

0

fDate

0-0 0

Abstract

Good correlation has been established between high speed shearing of solder joint at component level and board level drop tests, endorsing high speed shearing as a viable quality assurance test for manufacturing and incoming inspection. The high speed shear characteristics of solder joints under different test conditions (shear speed, shear angle, and temperature) and aging conditions (multiple reflow, temperature humidity, and salt spray) have been evaluated. Preliminary S-N characteristic for SnPb_OSP and SnAg_OSP solder joints have been generated using high speed cyclic bends test. These could be devolved into a life prediction model for board level solder joints in product drop impact

Keywords

ageing; bending strength; impact strength; impact testing; production testing; quality assurance; shearing; solders; S-N characteristic; SnAg; SnPb; aging conditions; cyclic bends test; drop impact; drop tests; life prediction model; microimpact characterisation; quality assurance; shear characteristics; solder joint; Aging; Humidity; Inspection; Manufacturing; Quality assurance; Shearing; Soldering; Spraying; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2006. Proceedings. 56th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

1-4244-0152-6

Type

conf

DOI

10.1109/ECTC.2006.1645627

Filename

1645627