Title :
Dispersive effects of a thin metal-insulating layer in MMIC structures
Author :
Polycarpou, A.C. ; Lyons, M.R. ; Balanis, C.A.
Author_Institution :
Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
Abstract :
A full-wave finite element analysis is used to examine the dispersive effects of a thin metal-insulating layer in CPW and microstrip MMICs. This layer is often encountered in the MMIC manufacturing process residing on top of a semiconducting substrate. The effects of metallization thickness are also examined.
Keywords :
MMIC; coplanar waveguides; dispersion (wave); finite element analysis; integrated circuit metallisation; microstrip circuits; CPW; MMIC manufacturing process; MMIC structures; dispersive effects; full-wave finite element analysis; metal-insulating layer; metallization thickness; microstrip MMICs; semiconducting substrate; Coplanar waveguides; Dielectrics and electrical insulation; Dispersion; Finite element methods; Frequency dependence; Impedance; Isolation technology; MMICs; Microstrip; Substrates;
Conference_Titel :
Microwave Symposium Digest, 1996., IEEE MTT-S International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-3246-6
DOI :
10.1109/MWSYM.1996.508517
