• DocumentCode
    2139797
  • Title

    Design and development of microprocessor based quantitative impedance system for pulmonary oedema

  • Author

    Khan, M.R. ; Manchanda, S.C. ; Mustajab, P. ; Khan, M.

  • Author_Institution
    Dept. of Electr. Eng., Aligarh Muslim Univ., India
  • fYear
    1995
  • fDate
    15-18 Feb 1995
  • Firstpage
    42374
  • Lastpage
    42375
  • Abstract
    Transthoracic Electrical Impedance (TEI) has been used for detecting pulmonary oedema for quite some times. However the noninvasive technique could only be successfully used on a quantitative or semi-quantitative basis if control TEI (patient´s normal disease free TEI) is available. A microprocessor based system has been developed which can predict control transthoracic electrical impedance. This can quickly detect semi-quantitatively whether a patient with heart disease or a Jawan being air lifted to high altitude (more than 3000 m) is developing or has developed pulmonary oedema and to monitor the effect of therapy. The system should be of immense additional help for the bedside noninvasive monitoring of cardiac patients and early detection of pulmonary complications
  • Keywords
    bioelectric phenomena; computerised monitoring; electric impedance measurement; lung; medical diagnostic computing; microcomputer applications; patient monitoring; Jawan; bedside noninvasive monitoring; cardiac patients; heart disease; high altitude air lifted patient; medical instrumentation; microprocessor based quantitative impedance system; noninvasive technique; pulmonary complications; pulmonary oedema; transthoracic electrical impedance; Aging; Cardiac disease; Cardiology; Cardiovascular diseases; Electrodes; Hypertension; Impedance; Medical treatment; Microprocessors; Patient monitoring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1995 and 14th Conference of the Biomedical Engineering Society of India. An International Meeting, Proceedings of the First Regional Conference., IEEE
  • Conference_Location
    New Delhi
  • Print_ISBN
    0-7803-2711-X
  • Type

    conf

  • DOI
    10.1109/RCEMBS.1995.508666
  • Filename
    508666