Integrated board-level phased array antenna solution for 60 GHz radio

Author

Hong, Wonbin ; Baek, Kwang-hyun ; Goudelev, Alexander

Author_Institution

DMC Res. Center, Samsung Electron., Suwon, South Korea

fYear

2012

fDate

8-14 July 2012

Firstpage

1

Lastpage

2

Abstract

A novel integrated board-level phased array antenna package devised using low-cost, high volume PCB (FR4) is presented. The presented antenna topology eliminates the need for ball grid array (BGA)/land grid array (LGA) type surface mount packaging as the antenna is directly embedded in the circuit board. This results in significant reduction in fabrication and mass production cost. A multi-element array antenna prototype is simulated, fabricated and measured and its performance is determined to be applicable for gigabit WiFi such as WiGig and IEEE 802.11ad.

Keywords

antenna phased arrays; ball grid arrays; radio networks; wireless LAN; BGA; FR4; IEEE 802.11ad; WiGig; antenna topology; ball grid array; gigabit Wi-Fi; high volume PCB; integrated board-level phased array antenna solution; land grid array type surface mount packaging; mass production cost; multielement array antenna prototype; radio network; Antenna measurements; Arrays; Phased arrays; Printed circuits; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium (APSURSI), 2012 IEEE

Conference_Location

Chicago, IL

ISSN

1522-3965

Print_ISBN

978-1-4673-0461-0

Type

conf

DOI

10.1109/APS.2012.6348521

Filename

6348521